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The three-day international Flash Memory Summit FMS2023 was held at the Santa Clara Convention Center in Santa Clara, California, U.S.A. The FMS Flash Memory Summit is a prestigious international conference in the field of storage, showcasing the latest technological advancements in flash memory and focusing on the world's leading advanced technologies and products for 3D NAND Flash, DNA storage, CXL, AI, DRAM, automotive, and data centers. YEESTOR made a grand appearance with a full range of its latest products and storage solutions, including storage controllers and storage modules, to share the its latest technology and application achievements in consumer electronics, industrial and automotive storage, and other fields.
Focus on demand for storage, and leverage core advantage in controllers
YEESTOR's full range of storage controller products, including PCIe Gen3, SATA3.2, eMMC5.1, SPI NAND, USB3.2, SD6.1, etc., have been supplied in mass quantity to servers, gaming consoles, laptops, tablets, mobile phones, and industrial markets. In the meantime, YEESTOR continues to enhance its product innovation capability and launch highly competitive products to answer market demand.
The eMMC5.1 controller YS8297 on display this time adopts 28nm technology, which is the most advanced eMMC5.1 controller process in the world. Thanks to this advanced technology, this chip has shorter data input and output delays, greater signal anti-interference capability, and excellent power duration. YS8297 supports 2D MLC, 3D TLC/QLC NAND Flash, ONFI 3.X, Toggle 2.0 Flash interfaces, with sequential read/write speeds of up to 330/230MB/s, and supports both 1.8V and 1.2V interface voltage.
Meanwhile, the YS8297 is equipped with a new generation high-performance LDPC error correction engine, supports BCH, effectively supports the new generation of NAND Flash, and is compatible with Flash of different fabrication technologies. It provides E2E end-to-end data protection, further enhances the reliability of eMMC, and is well-suited for consumer electronics, industrial-grade products, and other fields.
At the summit, YEESTOR also announced the parameters of the upcoming PCIe Gen4 NVMe 2.0 SSD YS9303 controller, which is perfect for Client SSDs due to its excellent read/write performance as well its low power consumption and low cost.
The YS9303 is based on advanced 12nm technology, supports NVMe 2.0 interface technology standard, and adopts YEESTOR's proprietary NVMe IP. It supports IO rates up to 3200MT/s, and provides 4 Lane and 4 NAND Flash channels, with sequential read/write speeds up to 7400MB/s and 7000MB/s.
This chip employs a DRAM-less design and supports an interface voltage of 1.2 V. It supports E2E data protection and uses YEESTOR's proprietary 4K code length LDPC, effectively enhancing data constancy and durability, and improving the reliability and service life of the flash memory.
As electronic devices are getting thinner and lighter with better performance, it poses higher requirements for SSDs and eMMC5.1 controllers in terms of lower power consumption and smaller size. The two chips launched this time are technological innovations that respond to the market trend, which adds to the storage product portfolio of YEESTOR and meets the needs of the intelligent terminal data storage market.
Target automotive and industrial storage, and serve the world with highly reliable products
In recent years, YEESTOR has been vigorously exploring the industrial-grade storage and automotive storage fields. It has launched complete industrial-grade storage solutions and automotive-grade eMMC storage, which have been favored by many industrial/automotive customers for their excellent performance and high reliability.
At the summit, YEESTOR presented industrial/automotive storage products including 2.5-inch SATA SSD, mSATA SSD, M.2 SSD, U.2 SSD, BGA SSD, and eMMC, all of which are equipped with YEESTOR's proprietary storage controller, featuring wide temperature range, high customization, high reliability, high-density packaging, and large capacity. Such features can enable the storage products to have a perfect performance in all kinds of harsh conditions. The products have been widely used in multiple industrial fields, and have formed an influence in rail transportation, electricity, communication, automotive, industrial control, etc.
In industrial embedded system applications, BGA SSD, which integrates the advantages of high performance, lightweight, low power consumption, and good cost efficiency, provides excellent storage solutions. YEESTOR's BGA SSD products support SATA and PCIe interfaces and employ pSLC and TLC particles. The packaging of PCIe Gen3x4 BGA SSD uses BGA499 Ball. With a size of only 20x22x1.8mm, it offers excellent performance, enabling E2E end-to-end data protection and achieving an operating temperature range of -55 °C to 85°C and a large optional range of 120GB~960GB. The products have been widely recognized by many industrial customers.
A number of YEESTOR automotive-grade eMMC storage chips have also attracted much attention. Equipped with YEESTOR's proprietary eMMC controller, the products have excellent read/write performance and high response speed. They have also been certified by Automotive Electronics Council's AEC-Q100 Grade 2 automotive-grade test and can ensure stable operation even in extreme conditions. In the future, YEESTOR will also offer automotive-grade reliability, durability, and stability through its BGA SSD products, and focus on UFS automotive-grade memory products to provide a more comprehensive and high-quality automotive storage solution for customers in all application scenarios.
Conclusion
YEESTOR will continue to focus on developing storage technology and making innovations and breakthroughs. The company is willing to serve the global storage industry partners with its advanced storage control technology, comprehensive product portfolio, and fast market expansion, and provide full-stack storage and computing solutions with storage control technology as the key value for the applications in various industries including mobile computing terminals, smart home, intelligent Internet of Things, data centers and cloud platforms, industrial Internet, and intelligent automobiles.
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